TOKYO, Japan, September 16, 2025 - (JCN Newswire via SeaPRwire.com) – Honda R&D Co., Ltd. (Honda) today announced that it has developed a new “chemical sorting” technology, which sorts and extracts reusable plastics from waste plastic parts that contain solid contaminants unique to automotive waste. Honda will build a pilot facility with a maximum processing capacity of 350 tons per year and verify the technology by the end of 2026, striving to put it into practical use by around 2029.The solid contaminant separation technology newly developed by Honda uses chemical sorting, that dissolves the resin in a solvent to remove solid contaminants and extract high-purity resin. Waste automotive plastic parts generally contain non-plastic solid contaminants such as metal inserts*1, pieces of rubber hoses and gaskets, and reinforcing materials such as glass fiber contained in the resin. To date, recycling of waste plastic parts containing solid contaminants has been done mostly through “physical sorting” processes which sort contaminants manually or by machine. However, recycling via physical sorting has various challenges, including an increase in cost associated with the sorting process.The use of the newly-developed chemical sorting technology enabled Honda to improve the solid contaminant separation rate to more than 99%, which previously has not exceeded the range of approximately 80%, resulting in the extraction of high-purity plastics. After undergoing mechanical and chemical recycling processes, reusable plastics extracted through the chemical sorting technology with a purity of more than 99%, will be reused as automotive materials, enabling closed-loop recycling.Issues with conventional recycling of waste plastic parts- Limitations due to the size of contaminants Conventional separation method requires the optimization of specifications of filters and sorting process for the size of each target contaminant. Waste plastic parts contain solid contaminants of various sizes. Since the sizes of contaminants are unpredictable, the filter mesh has to be set very fine, which often causes clogging and halts processing.- Limitations due to the complexity of materialsPlastics used in automotive parts consist of multiple resins, additives, fillers, and attached components, making it difficult to efficiently separate them through the conventional method. - Difficulty in scaling upWhen fine-mesh filters are used to sort out most contaminants, the filters need to be replaced every few hours due to clogging. Therefore, while recycling is feasible at the research level, it has been technically challenging to establish a continuous process capable of stably processing large volumes of waste materials.- Lack of industrywide collaborationFor practical recycling, an industrywide initiative is indispensable; however, sufficient collaborative frameworks have yet to be established.What Honda achieved with the new technology By using coarse-mesh filters that are less prone to clogging to sort out millimeter-sized coarse contaminants, and using centrifuges to physically separate micrometer-sized*2 fine contaminants, the new chemical sorting technology developed by Honda eliminates the need to adjust the specifications of removal filters depending on the size of each contaminant, enabling the thorough removal of contaminants of all sizes. It also minimizes the need for maintenance and filter replacement, enabling the establishment of a continuous process capable of stable operation on an industrial scale.With these features of its new technology, Honda became capable of removing contaminants of various sizes in the recycling of ELV-derived waste plastics, which expands the range of recyclable parts. This enables Honda to achieve both economic feasibility and scalability, and realize practical application of its new technology. Moreover, based on the expertise and technological foundation Honda has amassed through its long history of developing resource recovery technologies, the recent progress in collaboration with external partners has supported the development of this new technology.Benefits of the solid contaminant separation technology developed by HondaReduction of capital investment through the reduction of steps in the sorting process.Reduction of process cost through the shortening of the process.Improvement of recycling yield*3 (through the reduction of the amount of resin removed along with contaminants being removed in each sorting step).Efficient recovery of high-quality plastics that will comply with quality standards required for the recycling processes that follow, by preventing metal and rubber contamination.Suppression of plastic degradation by dissolving resin at temperatures lower than the resin’s degradation point.Ability to discharge recycled resin in a solid state, which enables the recovery of resin in pellet*4 form.Reduction of COâ‚‚ emissions, as the technology enables the recycling of reinforced fiber plastics that were previously incinerated.Resource circulation has been one of the key focus areas for Honda to further advance its mobility products and services, and this newly-developed technology is expected to be applicable also to other materials, including engineering plastics. Honda will continue its recycling-related research and take on the challenge to develop its products with 100% use of sustainable materials.  *1 Components made from metals that are pre-embedded into molded components such as plastic and rubber products.*2 1 micrometer=0.001 millimeter.*3 The ratio of a good product obtained to the amount of raw material input. In this context, it refers to the amount of resin successfully recovered divided by the amount of waste material fed into the process.*4 Raw material used for plastic molding, typically in small granules of about 3–5 millimeters in size.  Copyright 2025 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com

TOKYO, September 16, 2025 - (JCN Newswire via SeaPRwire.com) — NEC Corporation (NEC; TSE: 6701) has published the ESG Databook 2025, a report on its Environmental, Social, and Governance (ESG) initiatives from April 2024 onwards.NEC ESG Databook 2025URL: https://www.nec.com/en/global/sustainability/report/index.htmlAs outlined in its Mid-term Management Plan 2025 (*), NEC aims to create social and environmental value through its business, focusing on growth areas. As part of its financial strategy, NEC is strengthening its non-financial foundations to support the sustainable growth of the company and society. The ESG Databook 2025 was composed with reference to the four components of sustainability information disclosure standards of the International Sustainability Standards Board (ISSB) and the Sustainability Standards Board of Japan (SSBJ), consisting of: "Governance," "Strategy," "Risk Management (including NEC’s unique approach to opportunity creation)," and "Metrics and Targets."As a result of these efforts, NEC continues to be included in major ESG indices, such as the Dow Jones Best-in-Class World Index and Asia Pacific Index, the FTSE4Good Index Series, and the MSCI ESG Leaders Indexes, which is one of the financial strategy targets set in the Mid-term Management Plan 2025.The main initiatives outlined in the ESG Databook 2025 are as follows:1. Initiatives to promote businesses that contribute to carbon neutrality and efforts to reduce capital costsIn response to growing interest in decarbonization among customers and society, NEC is introducing the "Client Zero" concept and specific initiatives. These initiatives involve first implementing the latest technologies in-house to accumulate expertise, and then broadly deploying this expertise to customers through NEC's value creation model, "BluStellar." NEC also provides more detailed information in this report on its participation in external environmental initiatives and its involvement with industry organizations.Additionally, for the fourth consecutive year, NEC has issued sustainability-linked bonds with KPIs based on the strength of its environmental initiatives, such as its selection as a CDP "A-List" (Climate Change) company for six consecutive years, to reduce its capital costs.2. Promoting human capital management that supports strategy and cultureNEC considers human capital management to be one of its most important management resources. To achieve its purpose and the Mid-term Management Plan 2025, NEC is promoting initiatives based on strategy and culture, as well as job-specific human resource management. By assigning the right person to the right job at the right time, NEC is able to respond to changes in the market environment and business needs, enabling the company to execute swift and resilient business strategies.In addition, NEC is promoting a cultural initiative based on the 3 pillars of "enhancing communication," "fostering proactive learning and career development," and "ensuring fair evaluations and offering competitive compensation," to secure and develop human resources with innovative ideas that drive its business.3. Strengthening security for NEC and society, and strengthening the acquisition and development of human resourcesNEC carries out business activities with significant meaning for society and therefore considers cybersecurity and information security to be critical issues in the social domain. Based on Japan’s Ministry of Economy, Trade and Industry’s "Cybersecurity Management Guidelines Ver3.0," and the U.S. National Institute of Standards and Technology (NIST)’s "Cybersecurity Framework (Version 2.0)," which was revised for the first time in ten years in February 2024, NEC is building a framework to strengthen its preventive defenses against evolving cyberattacks and to enhance resilience against such threats.Cybersecurity Management Report 2025 (published in September 2025)URL: https://www.nec.com/en/global/sustainability/security/index.htmlGuided by the NEC Way, NEC aims to create the social values of safety, security, fairness and efficiency and to promote a more sustainable world where everyone has the chance to reach their full potential. Moreover, NEC contributes to all 17 Sustainable Development Goals (SDGs) by actively engaging with various stakeholders and leveraging the power of information and communications technologies (ICT) to address social challenges. In response to demands from society, information disclosure related to sustainability is undergoing significant changes. To ensure that stakeholders understand NEC's approach to sustainability and its latest initiatives, the company plans to continue proactively disclosing information through the publication of the ESG Databook and through direct dialogue sessions.(*)Mid-term Management Plan 2025https://www.nec.com/en/global/ir/library/plan2025.htmlAbout NEC CorporationNEC Corporation has established itself as a leader in the integration of IT and network technologies while promoting the brand statement of “Orchestrating a brighter world.” NEC enables businesses and communities to adapt to rapid changes taking place in both society and the market as it provides for the social values of safety, security, fairness and efficiency to promote a more sustainable world where everyone has the chance to reach their full potential. For more information, visit NEC at https://www.nec.com.  Copyright 2025 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com

TOKYO, Sept 16, 2025, FREMONT, Calif., Sept 15, 2025 - (JCN Newswire via SeaPRwire.com) - JSR Corporation, a leading technology company focused on material innovation and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, Lam Research Corp. (Nasdaq: LRCX), a global leader in semiconductor fabrication equipment and services, today announced that JSR/Inpria and Lam have entered into a non-exclusive cross-licensing and collaboration agreement to advance leading-edge semiconductor manufacturing. The partnership is intended to accelerate the industry’s transition to next-generation patterning, including dry resist technology for EUV lithography, and advance the development of next-generation materials for atomic layer etching and deposition processes.The agreement capitalizes on JSR/Inpria’s innovative semiconductor materials, including metal oxide solutions and Lam’s deep capabilities in deposition, etch and EUV patterning, including Aether®, Lam’s ground-breaking dry resist equipment and process technology that reduces the cost and complexity of creating the intricate patterns required for chips for artificial intelligence (AI) and high-performance computing (HPC).The companies will collaborate to integrate JSR/Inpria’s patterning resists and films with Lam’s etch and dry resist deposition technologies. Lam and JSR/Inpria will also work together to expand innovation in several areas to support chipmakers as they scale in the AI era, including research and development related to metal oxide resists, high NA EUV patterning for advanced nodes, and other advanced films for next-generation patterning. In addition, leveraging JSR’s recent acquisition of Yamanaka Hutech Corporation, Lam and JSR plan to explore on new precursor materials and processes for advanced atomic layer deposition and etch solutions.“At JSR, we are committed to advancing cutting edge materials to enable our customers’ most demanding technology roadmaps,” said Toru Kimura, senior officer, JSR Corporation. “By combining JSR and Inpria’s materials expertise with Lam’s strengths in deposition, etch, and dry resist technologies, we aim to accelerate solutions for EUV lithography – including high NA – and support the industry to scale efficiently for the new AI era.“By richly complementing Lam’s proven atomic layer deposition and etch capabilities with JSR’s deep expertise in advanced patterning materials, this collaboration enables us to accelerate innovation at a time of rising semiconductor complexity,” said Vahid Vahedi, chief technology and sustainability officer, Lam Research. “This includes driving new low-NA and high-NA EUV patterning materials and metal oxide resists and providing greater access to Aether dry resist technology.”Inpria and Lam have also agreed to dismiss all claims against each other in the litigation Inpria v. Lam Research (Case 1:22cv01359) in the District Court of Delaware and all related inter partes review (IPR) proceedings.About JSR CorporationJSR Corporation is a global technology company developing cutting-edge materials. Our Electronic Materials business provides a wide range of semiconductor materials for advanced logic and memory, including photoresists and ancillaries, process materials such as CMP slurries, cleaning solutions, packaging materials, and precursors. JSR's Electronic Materials Division’s group companies include Inpria Corporation, acquired in 2021 for EUV metal oxide resists, and Yamanaka Hutech, added in August 2024 for high-purity CVD/ALD precursors. JSR delivers high-quality materials with added functionality, driving innovation in the semiconductor market and enabling customer breakthroughs. Please visit www.jsr.co.jpAbout Lam ResearchLam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com.JSR Corporation Contacts:Yuki KawashimaElectronic Materials Business Strategy Dept.Tel: +81-3-6218-3500e-mail: litho_semi@jsr.co.jpLam Research Contacts:Laura BakkenMedia RelationsTel: +1 (510) 572-5029e-mail: publicrelations@lamresearch.comRam GaneshInvestor RelationsTel: +1 (510) 572-1615Email: investor.relations@lamresearch.com Copyright 2025 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com