月份: 2026 年 3 月

TOKYO, Mar 4, 2026 - (JCN Newswire via SeaPRwire.com) - JCB Co., Ltd. (JCB), together with Resona Holdings, Inc. (Resona), announced the start of a project to commercialize ultra-wideband (UWB) payments that realize a new purchasing experience using UWB communication.The two companies have agreed to launch the world's first full-scale project for the practical application and commercialization of UWB payments. In 2026, JCB will work with multiple technology partners and collaborating merchants to demonstrate payment technology and value-added solutions for merchants, as well as user experience building projects to create new purchasing experiences. On top of that, JCB aims to launch small-scale commercial operations in 2027 and full-scale commercialization in earnest in 2028.The two companies are participating in the FiRa® Consortium, which standardizes and contributes to the development of UWB communication technology, as well as builds new payment experiences and value-added solutions for stores using UWB technology.About the UWB Payment ProjectThrough the activities of the FiRa Consortium, JCB, and Resona will standardize technologies and experiences for payment applications, and with the support of FiRa Consortium’s participating vendors, conduct technology tests. From 2026, the two companies will demonstrate UWB payments and value-added solutions together with multiple partner merchants and provide feedback to FiRa on the necessary technology development.In parallel, JCB and Resona will conduct research on user experience and store payment operations to confirm the acceptability of users and merchants.Moreover, in order to reduce the introduction load at merchants as much as possible, the project aims to build a payment infrastructure that can widely accept payment solutions using UWB provided by competitors. The project is aimed to launch on a small scale in 2027 and commercialize on a full-scale in 2028.In addition, the two companies will aim to realize new UWB payments through collaboration with a wide range of partners in Japan and other countries.image of UWB paymentThe Background of This ProjectUWB communication technology is a short-range wireless communication technology that has the characteristics of (1) accurate location of devices and (2) high-speed data communication and is being used in Japan and overseas for location verification of digital keys for cars and homes, indoor navigation, and tags.The technology is also used overseas in gateless public transportation systems. In the future, it is expected to be used for payments, as with NFC (Near Field Communication) and QR codes.Outside Japan, the spread of smartphones with UWB functions has been slow, but in Japan, smartphones that can use UWB communication are widely available, and can be utilized in advance of the rest of the world. Moreover, the diversification of cashless payments and the wide range of value-added solutions for users and stores are also characteristics of Japan's payment scene. The project believes that it is necessary to take advantage of this location and create new payment solutions to solve problems for users and stores and meet the needs of new solutions.Overview of “UWB Payments”UWB payments are a solution that can greatly improve the purchasing experience. Until now, it has been necessary to physically touch a card or smartphone at a payment terminal in a merchant or to scan a QR code. UWB payments will take advantage of the characteristics of short-range communication to build a new purchasing experience, such as building a hands-free payment experience even with a smartphone in a pocket or bag, and instantly conveying information such as diet restrictions from users to merchants.Also, by utilizing the accurate location information of smartphones, it is possible to realize value-added solutions for both users and merchants that have never been seen before, such as improving the efficiency of navigation and waiting in stores, distributing personalized advertisements and coupons using smart displays, and providing new customer service for VIP customers. It is expected to be used not only to improve the experience but also to be used as a labor-saving solution to address labor shortages.Comparison of NFC and UWB paymentsExamples of value-added solutions:Provide communication functions for both users and merchants. For example, it can be used to automate the communication of requests such as food allergy information, whether or not plastic bags are needed, whether receipts are present and addressed, loyalty program information, whether coupons are available and used, and requests such as handicap and assistance needs, and children's chair preparations.Provide special customer service experiences for VIP customers and support functions for stores. Customers can receive a special customer service experience without verbally communicating with the merchant’s staff, allowing stores to provide appropriate customer service based on specific customer needs.Enable 1-to-1 marketing capabilities for customers. Marketing utilization, such as displaying personalized information on smart displays near customers, distributing coupons to customers, and displaying personalized pricing.Past UWB Payments InitiativesIn January 2024, JCB and Resona entered into a strategic partnership for the "Hands-free Payment" project, an initiative aimed at building a new payment experience that does not require smartphone operation when using device-to-device communication technology. Using UWB communication technology by linking the smartphones held by customers who visit the store with payment terminals and various IoT devices installed in the store, it allows customers to complete the payment process from authentication to payment procedure without taking out a smartphone or activating the screen, and even keeping their smartphone in their bag or pocket.　By utilizing this solution, customers can grasp information at the time of their visit to the store and receive customer service and new in-store experiences, such as providing services for VIPs, preferential treatment, and coupon distribution.JCB also announced the development of a UWB-enabled app for iPhones and Apple Watches to support the project, along with a reference model of store checkout equipment and the launch of user testing. Through these efforts, JCB and Resona have been discussing and collaborating with their collaborative partners on technologies and business models.Looking ahead, JCB and Resona will work with multiple technology partners and collaborating merchants to carry out proof-of-concept initiatives for payment and merchant value-added solutions in 2026, with a phased commercial rollout planned for 2027 and full-scale commercialization targeted for 2028.About FiRa ConsortiumThe FiRa Consortium is a member-driven organization dedicated to transforming the way we interact with our environment by enabling precise location awareness for people and devices using the secured fine-ranging and positioning capabilities of Ultra-Wideband (UWB) technology. FiRa does this by driving the development of technical specifications and certification, advocating for effective regulations, and defining a broad set of use cases for UWB. To learn more about UWB and the FiRa Consortium, visit　www.firaconsortium.org.About Resona Holdings, Inc.With the Group's purpose of "Making the future positive with finance +," we continue to take on the challenge of transformation and creation in order to transform the future into a positive one with ideas that go beyond the framework of finance. Adhering to our basic stance of "customer joy is Resona's joy," we will work to "strengthen value creativity" and "next-generation management infrastructure" to respond to customers and local communities.About JCB Co., Ltd.JCB is a major global payment brand and a leading credit card issuer and acquirer in Japan. JCB launched its card business in Japan in 1961 and began expanding worldwide in 1981. Its acceptance network includes about 71 million merchants around the world. JCB Cards are now issued mainly in Asian countries and territories, with more than 175 million cardmembers. As part of its international growth strategy, JCB has formed alliances with hundreds of leading banks and financial institutions globally to increase its merchant coverage and cardmember base. As a comprehensive payment solution provider, JCB commits to providing responsive and high-quality service and products to all customers worldwide.For more information, please visit: www.global.jcb/en/ContactAnna TakedaJCB Corporate CommunicationsTel: +81-3-5778-8353Email: jcb-pr@info.jcb.co.jp Copyright 2026 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com

TOKYO, Mar 3, 2026 - (JCN Newswire via SeaPRwire.com) - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced a gold bump*1 transfer technology for the sintered gold (Au) bonding technology “AuRoFUSE™ Preforms.” This technology allows AuRoFUSE™ Preforms (gold bumps) to be formed even on semiconductor chips and substrates*2 with complex structures.Gold bump transfer substrate producedGold bumps after transferAdvantages of being able to transfer gold bumpsIn this technology, at first, gold bumps are formed on a substrate (transfer substrate). Then, the gold bumps are transferred to the target semiconductor chip or substrate. Openings are created on the silicon substrate used as the transfer substrate, and gold bumps are formed in them. By filling the entire opening, the gold bump is held by the substrate, eliminating the risk of dropping during the process. Meanwhile, during transfer, the gold bump shrinks under heat-treatment, forming a tiny gap between the opening and the gold bump. This allows easy extraction of gold bumps by the application of a force in the vertical direction.As the traditional gold bump formation process is a method that directly forms bumps on the target semiconductor chip or substrate, it is difficult to handle target chips and substrates with complex shapes, such as protrusions, dents, or open holes due to issues such as inconsistent resist heights.In this current transfer technology, gold bumps are manufactured separately and can be transferred only to the target locations. This allows the technology to also be applied to complex shapes. It can also be used with semiconductor chips and substrates that are difficult to process using photolithography*3 due to concerns about damage from stripping solutions and others.Manufacturing of transfer substrate and transfer and bonding process(1) Preparation of silicon substrate as transfer substrate(2) Application of photoresist to silicon substrate(3) Exposure and development of target pattern(4) Etching of silicon substrate to create holes(5) Application of AuRoFUSE™ using a squeegee, etc.(6) Vacuum drying of AuRoFUSE™ at room temperature and scraping off excess gold particles on the resist(7) Removal of resist to complete transfer substrate(8) Placement of transfer substrate on target (semiconductor chip or substrate) for gold bump formation, thermocompression at 10 MPa and 150℃ for one minute, followed by vertical lifting of substrate to transfer gold bumps(9) Bonding of post-transfer target through thermocompression at 20 MPa and 200℃ for 10 secondsAn illustration of the traditional gold bump formation process is available in the “Manufacturing of AuRoFUSE™ Preforms” section for reference on TANAKA’s website.About the sintered gold bonding technology “AuRoFUSE™ Preforms”Developed by TANAKA, “AuRoFUSE™ Preforms” is a bonding technology that forms bumps of all kinds of shapes using a paste comprising gold particles and an organic solvent. Through a thermocompression bonding process (20 MPa at 200℃ for 10 seconds), AuRoFUSE™ Preforms exhibits compression of approximately 10% in the compressive direction while showing minimal deformation in the horizontal direction. This gives them sufficient bonding strength*4 for practical applications. With the main component being gold, which has a high level of chemical stability, AuRoFUSE™ Preforms also provides excellent reliability after mounting.This technology enables miniaturization of semiconductor wiring and greater integration (higher density) for various types of chips. It is expected to contribute to the needs for miniaturization and better performance of semiconductors, which have been rising in recent years, including optical devices such as light-emitting diodes (LEDs) and semiconductor lasers (LDs), use in digital devices such as personal computers, smartphones, as well as in-vehicle components, micro-electromechanical systems (MEMS), and such.Traditionally, the main methods used in bump formation technology are soldering and plating. However, as solder tends to spread outward in molten state, there was the risk of short-circuiting through contact between electrodes as the bump pitch becomes finer. Meanwhile, plating can achieve a fine pitch, but because comparatively higher pressures are required during bonding, there is the possibility of causing chip damage. For reference, an illustration outlining the advantages of this technology compared with soldering and plating materials is provided in the “Comparison of AuRoFUSE™ Preforms with Other Materials” section on TANAKA’s website. This technology was developed to address these issues for use in next-generation high-density mounting and photonics-electronics integration devices.AuRoFUSE™ and TANAKA’s gold materialsAuRoFUSE™ is a paste-type bonding material containing a mixture of gold particles, with the particle diameter controlled to be submicron sized, and an organic solvent. Compared to the melting point of gold (approximately 1,064℃), bonding is possible at a low temperature of approximately 200℃.Gold is a material with low electrical resistance and extremely high thermal conductivity. Therefore, in power semiconductors that handle large currents and high-density chips that dissipate a lot of heat, it can efficiently dissipate heat and limit energy loss. Among precious metals, it is also particularly resistant to oxidation and has stable properties, making it less susceptible to corrosion after mounting and ion migration (a phenomenon in which metals move and cause short circuits). This allows it to maintain high reliability over long periods of time.TANAKA is highly skilled in precious metal material development technologies, developed since its establishment. It has used these technologies to undertake development of precious metal materials, such as gold, which plays a key role in the semiconductor field. With a system that integrates the entire chain of processes, from raw material procurement to material development, manufacturing, and recycling, TANAKA will contribute to the development of semiconductor technologies and the realization of a sustainable society while effectively using limited precious metal resources.*1 Bumps: Protruding electrodes*2 Substrate: Board that electrically and mechanically supports semiconductor chips mounted on it*3 Photolithography: Technology for forming fine circuit patterns on substrates*4 Bonding: Refers to shear strength (strength determined through application of a lateral load during testing)About TANAKASince its foundation in 1885, TANAKA has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volume of precious metals it handles. Over many years, TANAKA has manufactured and sold precious metal products for industry and provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and worldwide collaborate on manufacturing, sales, and technology development to offer a full range of products and services. With 5,591 employees, the group’s consolidated net sales for the fiscal year ended December 2024 were 846.9 billion yen.TANAKA Industrial Precious Metal Materials Portalhttps://tanaka-preciousmetals.comProduct inquiriesTANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/Press inquiriesTANAKA PRECIOUS METAL GROUP Co., Ltd.https://tanaka-preciousmetals.com/en/inquiries-for-media/Press Release: https://www.acnnewswire.com/docs/files/20260303_EN.pdf  Copyright 2026 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com

Kawasaki, Japan and Barcelona, Spain, March 3, 2026 - (JCN Newswire via SeaPRwire.com) - Fujitsu and BCN Port Innovation Foundation today announced a new agreement between Fujitsu Spain and the BCN Port Innovation Foundation to develop a proof of concept (PoC) for an ocean digital twin at the Port of Barcelona. This pioneering initiative is aimed at the regeneration of the marine environment, the protection of biodiversity and the promotion of the blue economy(1).Catalina Grimalt, CEO and President, BCN Port Foundation (left) and Ángeles Delgado, President of Fujitsu Technology Solutions S.A. (right) shaking hands after the signing ceremony to kick off the proof of concept.The project is based on the use of underwater drones combined with artificial intelligence and advanced analytics, capable of capturing high-resolution representations of the seabed. Using this non-destructive sensing approach, the digital twin will make it possible to visualize and quantify biodiversity, calculate biomass based on vegetation cover, and estimate blue carbon(2) associated with marine algae.This project lays the foundations for the BCN Port Innovation Foundation to have a unified digital platform that centralizes all information on port biodiversity and enables its long-term monitoring.With this initiative, Fujitsu reinforces its commitment to developing proprietary technology with social and environmental impact, aligned with climate neutrality goals and the protection of marine ecosystems, and consolidates its role as a technology partner in sustainable innovation projects in Spain.Fujitsu and the BCN Port Innovation Foundation plan to carry out the proof of concept in the Port of Barcelona during 2026.A new approach to measuring and protecting marine biodiversityGlobal marine ecosystems face a severe crisis due to global warming and ocean pollution. The EU is accelerating marine environmental conservation and restoration efforts, notably with the 2024 adoption of the Nature Restoration Law, which mandates marine ecosystem recovery.By integrating AI-enabled underwater data capture with advanced analytics, the Ocean Digital Twin transforms how marine ecosystems are measured, understood, and utilized. Autonomous surface and underwater vehicles follow optimized survey routes with real-time stabilization control, enabling consistent and repeatable seabed data acquisition and generating high-quality data suitable for AI processing.Machine learning models convert this data into quantitative environmental intelligence, estimating vegetation coverage, assessing habitat extent, and calculating blue carbon absorption. The technology also provides precise spatial data on seabed conditions, habitat distribution, and species types, creating a strong empirical foundation for the design and evaluation of conservation, restoration, and regeneration projects.In addition, the system enables continuous monitoring of multiple plant species, making it possible to analyze ecosystem evolution over time and anticipate potential impacts resulting from both climate change and port activity.Figure: Ocean Digital TwinEnvironmental simulation and data-driven decision-makingThe platform developed by Fujitsu enables the simulation of “what if” scenarios, helping pre-verification of environmental measures before they are implemented to prioritize investments based on their real impact. Thanks to the creation of a high-fidelity digital model, port authorities can identify priority areas for protection, as well as zones suitable for environmental restoration or rehabilitation.This simulation capability makes the digital twin a key tool for balancing port activity with the preservation of the natural environment, facilitating the design of more sustainable infrastructure and operations. Following a successful PoC, Fujitsu and BCN Port Innovation Foundation can collaborate to add regeneration and preservation simulation scenarios to the project.Blue economy, transparency and social engagementBeyond environmental conservation, the project could open up new opportunities within the blue economy, facilitating the potential development of marine research initiatives, environmental education and scientific outreach activities.Moreover, the visual and immersive nature of the digital twin enhances transparency and awareness, helping to bring knowledge of the marine environment closer to stakeholders and fostering greater understanding of the importance of protecting coastal ecosystems.Ángeles Delgado, president of Fujitsu Spain and Portugal, points out: “This project demonstrates how technology can become a true ally of sustainability. The ocean digital twin allows us to transform complex data from the marine environment into actionable information to protect biodiversity, promote blue carbon initiatives, and make evidence-based decisions.”(1) Blue economy:Achieving economic growth, job creation, and environmental preservation simultaneously while sustainably utilizing marine resources.(2) Blue carbon:Carbon captured by coastal and marine ecosystems through photosynthesis and subsequently stored in seabeds and deep seas.About FujitsuFujitsu’s purpose is to make the world more sustainable by building trust in society through innovation. As the digital transformation partner of choice for customers around the globe, our 113,000 employees work to resolve some of the greatest challenges facing humanity. Our range of services and solutions draw on five key technologies: AI, Computing, Networks, Data & Security, and Converging Technologies, which we bring together to deliver sustainability transformation. Fujitsu Limited (TSE:6702) reported consolidated revenues of 3.6 trillion yen (US$23 billion) for the fiscal year ended March 31, 2025 and remains the top digital services company in Japan by market share. Find out more: global.fujitsuAbout BCN Port InnovationBCN Port Innovation is a public-private collaboration initiative between the Port of Barcelona and the enterprise ecosystem aimed at promoting and validating innovative solutions in areas such as the logistics and port processes, mobility, and the energy transition, with a cross-cutting focus on digitalization and sustainability. More information: https://bcnportinnovation.org/en/Press ContactsFujitsu LimitedPublic and Investor Relations DivisionInquiriesBCN Port InnovationMar Fernándeze-mail: m.fernandez@bcnportinnovation.org  Copyright 2026 JCN Newswire via SeaPRwire.com. All rights reserved. www.jcnnewswire.com